Warp and Weft Wiring method for rapid, modifiable, self-aligned, and bonding-free fabrication of multi electrodes microfluidic sensors

TL;DR

This paper introduces a novel, rapid, and low-cost fabrication method for multi-electrode microfluidic sensors using Warp and Weft Wiring, enabling self-aligned, bonding-free, and modifiable device production suitable for Point-of-Care Tests.

Contribution

The paper presents a new Warp and Weft Wiring method for quick, self-aligned, and bonding-free fabrication of microfluidic sensors, advancing point-of-care diagnostic device development.

Findings

Successfully fabricated multi-electrode microfluidic sensors using WWW

Demonstrated potential applications in water quality, biomedical impedance, and cell analysis

Validated the method through experimental testing

Abstract

The need for rapid fabrication of microfluidic devices has become increasingly critical as microfluidics become part of biomedical sensors. Using Warp and Weft Wiring (WWW) of copper wires, this paper presents a novel low-cost method for rapid, self-aligned, bonding-free, and modifiable fabrication of multi-electrodes microfluidic sensors. All the proposed features are promising and highly recommended for the development of Point-of-Care Tests (POCTs), while most of the conventional methods have low chances of coming out of the research labs and play no role in POCTs development. To have an experimental proof of concept, the proposed chip was fabricated and then tested with two sets of experiments that showed the potential applications of water quality management, hygiene, biomedical impedance measurement, cell analysis, flow cytometry, etc.