Non-destructive Depth-Resolved Characterization of Residual Strain Fields in High Electron Mobility Transistors using Differential Aperture X-ray Microscopy
Darren C. Pagan, Md Abu Jafar Rasel, Rachel E. Lim, Dina Sheyfer,, Wenjun Liu, Aman Haque

TL;DR
This study demonstrates a non-destructive, depth-resolved method using differential aperture X-ray microscopy to map residual strain fields in high electron mobility transistors, revealing effects of gamma irradiation on GaN layers.
Contribution
It introduces the application of DAXM for depth-resolved strain mapping in HEMTs, enabling detailed analysis of residual stress at sub-micrometer scales.
Findings
Gamma irradiation reduces lattice spacing in GaN layers.
DAXM provides high-resolution, non-destructive strain measurements.
Strain concentrations are characterized in pristine and irradiated devices.
Abstract
Localized residual stress and elastic strain concentrations in microelectronic devices often affect the electronic performance, resistance to thermomechanical damage, and, likely, radiation tolerance. A primary challenge for characterization of these concentrations is that they exist over sub-m length-scales, precluding their characterization by more traditional residual stress measurement techniques. Here we demonstrate the use of synchrotron X-ray -based differential aperture X-ray microscopy (DAXM) as a viable, non-destructive means to characterize these stress and strain concentrations in a depth-resolved manner. DAXM is used to map two-dimensional strain fields between source and drain in a gallium nitride (GaN) layer within high electron mobility transistors (HEMTs) with sub-m spatial resolution. Strain fields at various positions in both pristine and irradiated HEMT…
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Taxonomy
TopicsSilicon Carbide Semiconductor Technologies · Advanced Electron Microscopy Techniques and Applications · Electron and X-Ray Spectroscopy Techniques
