The MAPS foil
S. Beol\'e (1), F. Carnesecchi (2), G. Contin (3), R. de Oliveira (2),, A. di Mauro (2), S. Ferry (2), H. Hillemanns (2), A. Junique (2), A. Kluge, (2), L. Lautner (2, 4), M. Mager (2), B. Mehl (2), K. Rebane (2, 5), F., Reidt (2), I. Sanna (2, 4), M. \v{S}ulji\'c (2)
TL;DR
This paper introduces a flexible, scalable detector module called 'MAPS foil' by embedding MAPS into FPCs with through-hole copper plating, demonstrated with ALPIDE chip prototypes.
Contribution
It presents a novel method for creating flexible, integrated detector modules using standard PCB manufacturing techniques, enabling large-scale production.
Findings
Prototypes embedding ALPIDE chip are functional.
The method allows scalable production of detector modules.
The MAPS foil is flexible, lightweight, and protected.
Abstract
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
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Taxonomy
TopicsCCD and CMOS Imaging Sensors · Particle Detector Development and Performance · Gas Sensing Nanomaterials and Sensors