Laser-actuated hermetic seals for integrated atomic devices

TL;DR

This paper presents a novel laser-actuated sealing technique for microfabricated atomic vapor cells, enabling high-quality, hermetic seals that mimic traditional glass-blown cells, with potential applications in atomic devices and MEMS.

Contribution

Introduction of laser-actuated microfabricated valves that replicate glass-blown cell sealing, enhancing miniaturization and fabrication versatility of atomic vapor cells.

Findings

Demonstrated laser-controlled make-seal and break-seal microstructures

Achieved zero-leak sealing of cesium vapor cells at wafer-level

Extended sealing techniques to microelectronics and MEMS packaging

Abstract

Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content has to meet high standards of purity and accuracy. Glass-blowing techniques and craftsmanship have evolved over many decades to achieve such standards in macroscopic vapor cells. With the emergence of chip-scale atomic devices, the need for miniaturization and mass fabrication has led to the adoption of microfabrication techniques to make millimeter-scale vapor cells. However, many shortcomings remain and no process has been able to match the quality and versatility of glass-blown cells. Here, we introduce a novel approach to structure, fill and seal microfabricated vapor cells inspired from the century-old approach of glass-blowing. In particular we demonstrate opening and closing single-use zero-leak microfabricated valves, actuated exclusively by laser, and operating in the same way as the "make-seals" and "break-seals" found in the filling apparatus of traditional cells. Such structures are employed to fill cesium vapor cells at the wafer-level. The make-seal structure consists of a glass membrane that can be locally heated and deflected to seal a microchannel. The break-seal is obtained by breaching a silicon wall between cavities. This new approach allows adapting processes previously restricted to glass-blown cells. It can also be extended to vacuum microelectronics and vacuum-packaging of micro-electro-mechanical systems (MEMS) devices.