A Nanometer-Thick Oxide Semiconductor Transistor with Ultra-High Drain Current
Zehao Lin, Mengwei Si, Vahid Askarpour, Chang Niu, Adam Charnas,, Zhongxia Shang, Yizhi Zhang, Yaoqiao Hu, Zhuocheng Zhang, Pai-Ying Liao,, Kyeongjae Cho, Haiyan Wang, Mark Lundstrom, Jesse Maassen, Peide D. Ye

TL;DR
This paper demonstrates a nanometer-thick In2O3 transistor with record high drain current and transconductance, achieved through high-quality oxide interfaces and high carrier density, promising for high-performance semiconductor devices.
Contribution
The work introduces a high-performance In2O3 transistor grown by ALD at BEOL-compatible temperatures with record high drain current and transconductance, advancing ultra-thin oxide semiconductors.
Findings
Drain current exceeds 10 A/mm, 2-3 times higher than previous transistors.
Achieves a record transconductance of 4 S/mm.
High carrier density (~6-7×10^13 /cm^2) and electron velocity (~10^7 cm/s).
Abstract
High drive current is a critical performance parameter in semiconductor devices for high-speed, low-power logic applications or high-efficiency, high-power, high-speed radio frequency (RF) analog applications. In this work, we demonstrate an In2O3 transistor grown by atomic layer deposition (ALD) at back-end-of-line (BEOL) compatible temperatures with a record high drain current exceeding 10 A/mm, the performance of which is 2-3 times better than all known transistors with semiconductor channels. A record high transconductance of 4 S/mm is also achieved among all transistors with a planar structure. It is found that a high carrier density and high electron velocity both contribute to this remarkably high on-state performance in ALD In2O3 transistors, which is made possible by the high-quality oxide/oxide interface, the metal-like charge-neutrality-level (CNL) alignment, and the high…
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Taxonomy
TopicsSemiconductor materials and devices · ZnO doping and properties · Electronic and Structural Properties of Oxides
