First-principles study of oxygen vacancy defects in orthorhombic Hf$_{0.5}$Zr$_{0.5}$O$_2$/SiO$_2$/Si gate stack
Junshuai Chai, Hao Xu, Jinjuan Xiang, Yuanyuan Zhang, Shujing Zhao,, Fengbin Tian, Jiahui Duan, Kai Han, Xiaolei Wang, Jun Luo, Wenwu Wang, and, Tianchun Ye

TL;DR
This study uses first-principles calculations to analyze oxygen vacancy defects in a specific ferroelectric Hf$_{0.5}$Zr$_{0.5}$O$_2$/SiO$_2$/Si gate stack, revealing their formation, stability, and role in charge trapping, which impacts device reliability.
Contribution
It constructs a stable atomic model of the orthorhombic Hf$_{0.5}$Zr$_{0.5}$O$_2$/SiO$_2$/Si gate stack and analyzes defect formation energies and charge transition levels, a first for this structure.
Findings
Oxygen vacancies are more favorable to form than other defects.
Defect charge transition levels are near the Si band edges.
Oxygen vacancies contribute to charge trapping in Si FeFET.
Abstract
The gate defect of the ferroelectric HfO-based Si field-effect transistor (Si FeFET) plays a dominant role in its reliability issue. The first-principles calculations are an effective method for the atomic-scale understanding of gate defects. However, the first-principles study on the defects of FeFET gate stacks, i.e., metal/orthorhombic-HfZrO/SiO/Si structure, has not been reported so far. The key challenge is the construction of metal/orthorhombic-HfZrO/SiO/Si gate stack models. Here, we use the HfZrO(130) high-index crystal face as the orthorhombic ferroelectric layer and construct a robust atomic structure of the orthorhombic-HfZrO/SiO/Si gate stack without any gap states. Its high structural stability is ascribed to the insulated interface. The calculated band offsets show that this…
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