Defects Evolution and Mg Segregation in Mg-implanted GaN with Ultra-High-Pressure Annealing
Y. Wang, K. Huynh, M. E. Liao, J. Tweedie, P. Reddy, M. H., Breckenridge, R. Collazo, Z. Sitar, M. Bockowski, X. Huang, M. Wojcik, M. S., Goorsky

TL;DR
This study investigates how ultra-high-pressure annealing at temperatures above 1400°C improves Mg activation in GaN by eliminating inversion domains and reducing defect density, enhancing p-type doping efficiency.
Contribution
It identifies the microscopic defects responsible for Mg incorporation and demonstrates the benefits of higher temperature annealing for defect reduction and dopant activation in GaN.
Findings
Annealing at 1400°C or higher eliminates inversion domains.
Higher temperature annealing reduces dislocation loop size and density.
Mg segregation is not observed at dislocation loops after high-temperature annealing.
Abstract
Annealing Mg-implanted homoepitaxial GaN at temperatures at or above 1400 {\deg}C eliminates the formation of inversion domains and leads to improved dopant activation efficiency. Extended defects in the form of inversion domains contain electrically inactive Mg after post-implantation annealing at temperatures as high as 1300 {\deg}C (one GPa N2 overpressure), which results in a low dopant activation efficiency. Triple axis X-ray data show that the implant-induced strain is fully relieved after annealing at 1300 {\deg}C for 10 min, indicating that the strain-inducing point defects formed during implantation have reconfigured. However, annealing at temperatures of 1400 {\deg}C to 1500 {\deg}C (also one GPa N2 overpressure) eliminates the presence of the inversion domains. Annealing at these higher temperatures and for a longer time does not have any further impact on the strain state.…
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Taxonomy
TopicsGaN-based semiconductor devices and materials · Semiconductor materials and devices · Metal and Thin Film Mechanics
