Non-equilibrium Phonon Thermal Resistance at MoS2/Oxide and Graphene/Oxide Interfaces
Weidong Zheng, Connor J. McClellan, Eric Pop, Yee Kan Koh

TL;DR
This study reveals that non-equilibrium phonons significantly influence thermal boundary resistance in 2D material interfaces, affecting heat dissipation understanding and device design.
Contribution
It introduces a model accounting for internal thermal resistance due to non-equilibrium phonons, explaining discrepancies in previous measurements.
Findings
Measured R of oxide/MoS2/oxide and oxide/graphene/oxide interfaces using TDTR.
Discovered R is 2-4 times lower than previous Raman thermometry measurements.
Estimated internal thermal resistance Rint for MoS2 and graphene as 31 and 22 m2 K/GW, respectively.
Abstract
Accurate measurements and physical understanding of thermal boundary resistance (R) of two-dimensional (2D) materials are imperative for effective thermal management of 2D electronics and photonics. In previous studies, heat dissipation from 2D material devices was presumed to be dominated by phonon transport across the interfaces. In this study, we find that in addition to phonon transport, thermal resistance between non-equilibrium phonons in the 2D materials could play a critical role too when the 2D material devices are internally self-heated, either optically or electrically. We accurately measure R of oxide/MoS2/oxide and oxide/graphene/oxide interfaces for three oxides (SiO2, HfO2, Al2O3) by differential time-domain thermoreflectance (TDTR). Our measurements of R across these interfaces with external heating are 2-to-4 times lower than previously reported R of the similar…
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Taxonomy
TopicsThermal properties of materials · Advanced Thermoelectric Materials and Devices · 2D Materials and Applications
