High carrier lifetimes in UMG multicrystalline wafers after P- diffusion compatible with high-efficiency cell structures
Nerea Dasilva-Villanueva, B\"ulent Ar{\i}kan, Hasan H\"useyin Canar,, David Fuertes Marr\'on, Bo-Kyung Hong, Ahmet Emin Ke\c{c}eci, S\"umeyye, Ko\c{c}ak B\"ut\"uner, Gence Bekta\c{s}, Ra\c{s}it Turan, Carlos del Ca\~nizo

TL;DR
This study demonstrates that high-quality UMG multicrystalline silicon wafers can achieve carrier lifetimes suitable for high-efficiency solar cells through optimized passivation and P-diffusion processes, indicating their potential for cost-effective PV technology.
Contribution
It introduces an effective passivation scheme for UMG-Si wafers that significantly improves carrier lifetime and device performance, enabling high-efficiency cell architectures.
Findings
Carrier lifetimes over 600 us in UMG-Si wafers after passivation.
Implied Voc up to 710 mV with Al2O3 passivation layers.
Record-breaking electronic quality of UMG-Si demonstrated.
Abstract
High-quality multicrystalline Upgraded Metallurgical Grade Silicon (UMG-Si) offers significant advantages over conventional polysilicon-based PV technology, associated to lower cost, lower energy budget and lower carbon footprint. The aim of this study is twofold: on the one hand, to ascertain the efficiency potential of solar cells based on this material in terms of carrier lifetime; and on the other hand, to explore, as a result of that, the adoption of high-efficiency cell architectures by establishing an effective rear-side passivation scheme for the implementation of passivated emitter rear contact (PERC) devices. The carrier lifetime and the surface passivation efficacy are investigated for different passivating layer configurations after single and double P-diffusion gettering processes. Layer stacks consisting of Al2O3, SiOxNy and a-SiNx:H capping overlayers have been optimized,…
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Taxonomy
TopicsSilicon and Solar Cell Technologies · Thin-Film Transistor Technologies · Semiconductor materials and interfaces
