Validating x-ray line-profile defect analysis using atomistic models of deformed material
C P Race, T Ungar, G Ribarik

TL;DR
This study validates the use of x-ray diffraction line-profile analysis for quantifying dislocation and stacking fault populations in deformed crystalline materials by comparing theoretical predictions with atomistic models.
Contribution
It provides a direct validation of line profile analysis against atomistic models, confirming its accuracy in quantifying defect populations in crystals.
Findings
Line profile analysis accurately predicts dislocation density and stacking fault fraction.
The outer cut-off radius relates to the cell size in dislocation distributions.
Results support the use of line profile analysis for defect quantification.
Abstract
The population of dislocation defects in a crystalline material strongly influences its properties, so the ability to analyse this population in experimental samples is of great utility. As a complement to direct counting in the transmission electron microscope, quantitative analysis of x-ray diffraction line profiles is an important tool. This is an indirect approach to quantification and so requires careful validation of the physical models that underly the inferential process. Here we undertake to directly evaluate the ability of line profile analysis to quantify aspects of the dislocation and stacking fault populations by exploiting atomistic models of deformed copper single crystals. We directly analyse these models to determine exact details of the defect content (our "ground truth"). We then generate theoretical line profiles for the models and analyse them using the same…
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Taxonomy
TopicsX-ray Diffraction in Crystallography · Microstructure and mechanical properties · Surface and Thin Film Phenomena
