Study of residual stress in reactively sputtered epitaxial Si-doped GaN films

TL;DR

This study investigates residual stress in Si-doped GaN films grown by reactive sputtering, revealing how nitrogen partial pressure influences dislocation densities, strain components, and stress states, with minimal impact from Si doping.

Contribution

It provides a detailed analysis of how N$_2$ partial pressure affects dislocation types, strain, and stress in epitaxial GaN films, highlighting intrinsic growth effects over Si doping influence.

Findings

Edge dislocation density decreases with lower N$_2$ partial pressure.

Biaxial stress switches from compressive to tensile below 75% N$_2$.

Ar incorporation affects strain and stress at low N$_2$ levels.

Abstract

Si-doped GaN films were grown on $\textit{c}$-sapphire by rf magnetron reactive co-sputtering of GaAs and Si at various partial pressures of N$_2$ in Ar-N2 growth atmosphere and their epitaxial character was ascertained by phi-scans. Energy dispersive x-ray spectroscopy revealed $\thicksim$2 at.% Si in all the films, but the N/Ga ratio decreased substantially as N$_2$ percentage was reduced from 100% to 10%. High resolution x-ray diffraction revealed the dominant presence of edge dislocations ($\thicksim$10$^{12}$ cm$^{-2}$) in the films grown at 30% - 100% N$_2$, which decreased to $\thicksim$5 x 10$^{11}$ cm$^{-2}$ at lower N$_2$ percentages, at which, the density of screw dislocations was found to increase and attained values comparable to that of edge dislocations. The lattice parameters ($\textit{a}$ and $\textit{c}$) were obtained independently to determine the in-plane and out-of-plane components of strain in films, which were analyzed to deduce the hydrostatic and biaxial strain contributions. The film grown at 100% N$_2$ displayed large micro-strain and hydrostatic strain due to excess/interstitial nitrogen, both of which decreased with the initial reduction of N$_2$ percentage, but increased again below 30% N$_2$ due to Ar incorporation. The films grown above 75% N$_2$ displayed compressive biaxial stress, which is attributed to possible nitrogen incorporation into grain boundaries and tensile side of edge dislocations. The reversal of biaxial stress to tensile character in films grown below 75% N$_2$ is explained by the prevalence of in-plane tensile stress generated during coalescence. The tensile stress decreased in films grown below 30% N$_2$, which is ascribed to the Ar incorporation and voided morphology. The presence of Si in the films does not have a significant influence on strain behaviour and appears to be masked by the dominant growth-related intrinsic effects.