Microstructure Surface Reconstruction from SEM Images: An Alternative to Digital Image Correlation (DIC)

TL;DR

This paper presents a novel 3D surface reconstruction method from SEM images that provides non-invasive, out-of-plane surface measurements, offering an alternative to traditional 2D Digital Image Correlation techniques.

Contribution

The proposed approach reconstructs 3D surface microstructure and motion from SEM images, enabling out-of-plane measurements without surface patterning, unlike DIC.

Findings

Successfully reconstructs 3D surface topography and motion.

Provides strain tensor mapping for material failure prediction.

Offers a non-invasive alternative to DIC with out-of-plane capabilities.

Abstract

We reconstruct a 3D model of the surface of a material undergoing fatigue testing and experiencing cracking. Specifically we reconstruct the surface depth (out of plane intrusions and extrusions) and lateral (in-plane) motion from multiple views of the sample at the end of the experiment, combined with a reverse optical flow propagation backwards in time that utilizes interim single view images. These measurements can be mapped to a material strain tensor which helps to understand material life and predict failure. This approach offers an alternative to the commonly used Digital Image Correlation (DIC) technique which relies on tracking a speckle pattern applied to the material surface. DIC only produces in-plane (2D) measurements whereas our approach is 3D and non-invasive (requires no pattern being applied to the material).