Influence of generated defects by Ar-implantation on the thermoelectric properties of ScN
R. Burcea, J.-F. Barbot, P.-O. Renault, D. Eyidi, T. Girardeau, M., Marteau, F. Giovannelli, A. Zenji, J-M. Rampnoux, S. Dilhaire, P. Eklund and, A. Le Febvrier

TL;DR
This study demonstrates that argon ion implantation creates stable defects in ScN thin films, significantly reducing thermal conductivity and potentially enhancing thermoelectric efficiency through defect engineering.
Contribution
It introduces a method of defect engineering via argon ion implantation to improve thermoelectric properties of ScN by reducing thermal conductivity while maintaining electrical performance.
Findings
Thermal conductivity reduced from 12 to 3 W/m·K at 300 K.
Defects such as interstitial clusters and argon-vacancy complexes are stable up to 750 K.
Post-annealing partially restores electrical properties but retains reduced thermal conductivity.
Abstract
Nowadays, making thermoelectric materials more efficient in energy conversion is still a challenge. In this work, to reduce the thermal conductivity and thus improve the overall thermoelectric performances, point and extended defects were generated in epitaxial 111-ScN thin films by implantation using argon ions. The films were investigated by structural, optical, electrical, and thermoelectric characterization methods. The results demonstrated that argon implantation leads to the formation of stable defects (up to 750 K operating temperature) were identified as interstitial type defect clusters and so-called argon-vacancy complexes. The insertion of those specific defects induces acceptor-type deep levels in the bandgap yielding to a reduce of the free carrier mobility. With a reduce electrical conductivity, the irradiated sample exhibited higher Seebeck coefficient maintaining the…
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