Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies
Gabriella Carini, Marcel Demarteau, Peter Denes, Angelo Dragone, Farah, Fahim, Carl Grace, Shaorui Li, F Mitch Newcomer, Brianna Yi

TL;DR
This paper discusses the importance of microelectronics for DOE projects and proposes a business model to develop an ecosystem involving CAD tools, design IPs, and fabrication access to support DOE's mission.
Contribution
It introduces a new business model for building a microelectronics ecosystem tailored to DOE needs, integrating CAD tools, design IPs, and fabrication access.
Findings
Current initiatives support microelectronics development for DOE.
A proposed ecosystem model includes CAD tools, IPs, and fabrication access.
Recommendations aim to enhance DOE's microelectronics infrastructure.
Abstract
Microelectronics development is critical to a wide number of DOE projects and mission space. Creating Helpful Incentives to Produce Semiconductors (CHIPS) and manufacturing Application Specific Integrated Circuits (ASIC) are important to DOE, so the infrastructure that allows DOE to carry out its mission needs to exist. This paper discusses the current initiatives and recommends a business model to build an ecosystem for microelectronics design for DOE which includes three main building blocks: the Computer Aided Design (CAD) - Electronic Design Automation (EDA) design tools, basic design IPs, and access to semiconductor fabrication facilities.
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsSpace Technology and Applications · Nanotechnology research and applications · 3D IC and TSV technologies
