Integration and Packaging

TL;DR

This paper discusses the advantages and prospects of 3D integration technology, which combines sensors and electronics monolithically to achieve high resolution and signal quality for applications in high energy physics and beyond.

Contribution

It provides an overview of 3D integration benefits, ongoing projects, and future prospects in high energy physics and related fields.

Findings

3D integration enables small, fine pitch pixels with excellent signal/noise ratio.

Monolithic integration allows for high position and time resolution.

Ongoing projects demonstrate the practical advantages of 3D hybrid bonding.

Abstract

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.