A photonic integrated chip platform for interlayer exciton valley routing

TL;DR

This paper presents a CMOS-compatible photonic chip platform that enhances the optical coupling and routing of interlayer excitons in 2D heterostructures, enabling improved optoelectronic and quantum communication applications.

Contribution

It introduces a novel integrated chip design that boosts near-field coupling of interlayer excitons with microresonator modes, facilitating efficient valley state readout.

Findings

Enhanced exciton-photon coupling via microresonator integration

Selective emission routing through asymmetric light transmission

Potential for improved quantum communication applications

Abstract

Interlayer excitons in two dimensional semiconductor heterostructures show suppressed electron-hole overlap resulting in longer radiative lifetimes as compared to intralyer excitons. Such tightly bound interlayer excitons are relevant for important optoelectronic applications including light storage and quantum communication. Their optical accessibility is, however, limited due to their out-of-plane transition dipole moment. In this work, we design a CMOS compatible photonic integrated chip platform for enhanced near field coupling of these interlayer excitons with the whispering gallery modes of a microresonator, exploiting the high confinement of light in a small modal volume and high quality factor of the system. Our platform allows for highly selective emission routing via engineering an asymmetric light transmission which facilitates efficient readout and channeling of the excitonic valley state from such systems.