A Timing Yield Model for SRAM Cells in Sub/Near-threshold Voltages Based on A Compact Drain Current Model
Shan Shen, Peng Cao, Ming Ling, and Longxing Shi

TL;DR
This paper introduces a compact drain current model for SRAM in sub/near-threshold voltages, enabling accurate failure probability estimation with significantly reduced data requirements compared to traditional Monte Carlo simulations.
Contribution
It proposes a new drain current model and analytical failure probability models for SRAM at low voltages, improving accuracy and efficiency over existing methods.
Findings
Models achieve less than 11% error at 0.5V VDD.
Data sample size is 43.6 times smaller than state-of-the-art.
Validated across different voltages and temperatures.
Abstract
Sub/Near-threshold static random-access memory (SRAM) design is crucial for addressing the memory bottleneck in energy-constrained applications. However, the high integration density and reliability under process variations demand an accurate estimation of extremely small failure probabilities. To capture such a rare event in memory circuits, the time and storage overhead of conventional Monte Carlo (MC) simulations cannot be tolerated. On the other hand, classic analytical methods predicting failure probabilities from a physical expression become inaccurate in the sub/near-threshold region due to the assumed distribution or the oversimplified drain current model for nanoscale devices. This work first proposes a simple but efficient drain current model to describe the drain-induced barrier lowering effect at low voltages. Based on that, the probability density functions of the interest…
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Taxonomy
TopicsSemiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design · Low-power high-performance VLSI design
