DASP: Defect and Dopant ab-initio Simulation Package
Menglin Huang, Zhengneng Zheng, Zhenxing Dai, Xinjing Guo, Shanshan, Wang, Lilai Jiang, Jinchen Wei, and Shiyou Chen

TL;DR
DASP is an automated software package that performs comprehensive ab-initio calculations of defect and dopant properties in semiconductors, enabling high-throughput thermodynamic and electronic analysis.
Contribution
It introduces a modular software integrating multiple calculations for defect properties, leveraging the materials genome database for high-throughput stability predictions.
Findings
Automates defect and dopant property calculations.
Enables high-throughput thermodynamic stability analysis.
Provides detailed carrier dynamics and recombination properties.
Abstract
In order to perform automated calculations of defect and dopant properties in semiconductors and insulators, we developed a software package, Defect and Dopant ab-initio Simulation Package (DASP), which is composed of four modules for calculating: (i) elemental chemical potentials, (ii) defect (dopant) formation energies and transition energy levels, (iii) defect and carrier densities and (iv) carrier dynamics properties of high-density defects. DASP uses the materials genome database for quick determination of competing secondary phases and calculation of the energy above convex hull when calculating the elemental chemical potential that stabilizes compound semiconductors, so it can perform high-throughput prediction of thermodynamic stability of multinary compounds. DASP calls the ab-initio softwares to perform the total energy, structural relaxation and electronic structure…
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