Non-destructive mapping of stress, strain and stiffness of thin elastically deformed materials
Guo-Yang Li, Artur L. Gower, Michel Destrade, Seok-Hyun Yun

TL;DR
This paper introduces a non-invasive method to measure stress and strain in thin elastic materials by analyzing elastic wave speeds, verified through optical coherence tomography on various materials, regardless of their unknown or altered properties.
Contribution
The authors develop a universal dispersion curve for Lamb waves enabling in situ stress and strain measurement without prior knowledge of material properties.
Findings
Successfully measured stress and strain in rubber, cling film, and leather.
Validated the method with optical coherence tomography.
Applicable to various thin elastic materials.
Abstract
Knowing the stress within a soft material is of fundamental interest to basic research and practical applications, such as soft matter devices, biomaterial engineering, and medical sciences. However, it is challenging to measure stress fields in situ in a non-invasive way. It becomes even more difficult if the mechanical properties of the material are unknown or altered by the stress. Here we present a robust non-destructive technique capable of measuring in situ stress and strain in elastically deformed thin films without the need to know their material properties. The technique is based on measuring elastic wave speeds, and then using a universal dispersion curve we derived for Lamb wave to predict the local stress and strain. Using optical coherence tomography, we experimentally verified the method for a rubber sheet, a cling film, and the leather skin of a musical instrument.
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Taxonomy
TopicsOptical Coherence Tomography Applications · Photoacoustic and Ultrasonic Imaging · Advanced Fiber Optic Sensors
