Modeling the debonding process of osseointegrated implants due to coupled adhesion and friction
Katharina Immel, Vu-Hieu Nguyen, Guillaume Haiat, Roger A. Sauer

TL;DR
This paper develops a 3D finite element model incorporating adhesion and friction to simulate and analyze the debonding process of osseointegrated implants, aiming to improve understanding of implant stability.
Contribution
It introduces a novel contact formulation combining a modified Coulomb's friction law with a cohesive zone model for better simulation of bone-implant interface debonding.
Findings
Partial osseointegration significantly affects implant stability.
Adhesive effects influence long-term debonding behavior.
Optimal parameters depend on patient-specific factors.
Abstract
Cementless implants have become widely used for total hip replacement surgery. The long-term stability of these implants is achieved by bone growing around and into the porous surface of the implant, a process called osseointegration. However, debonding of the bone-implant interface can still occur due to aseptic implant loosening and insufficient osseointegration, which may have dramatic consequences. The aim of this work is to describe a new 3D finite element frictional contact formulation for the debonding of partially osseointegrated implants. The contact model is based on a modified Coulomb's friction law (Immel et al. 2020, Biomech. Model. Mechanobiol.) that takes into account the tangential debonding of the bone-implant interface. This model is extended in the direction normal to the bone-implant interface by considering a cohesive zone model, to account for adhesion phenomena in…
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