Findings of the 2nd Photonics and Electronics Technology for Extreme Scale Computing Workgroup (REPETE): Design Challenges for Socket Level Photonic I/O

TL;DR

This paper reports on the findings of the REPETE workgroup, focusing on the design challenges of implementing socket-level photonic I/O for high-performance computing interconnects, highlighting current technologies and future research directions.

Contribution

It provides a comprehensive overview of technical challenges and state-of-the-art solutions for integrating photonics into socket-level I/O in HPC systems, guiding future research and development.

Findings

Identified key technical challenges in socket-level photonic I/O

Reviewed current photonic and copper interconnect solutions

Outlined future research directions for photonic integration

Abstract

To inform research activities in HPC interconnect of strategic importance to the USG beyond 2018, in January of 2018, the DoD sponsored the 2nd Photonics and Electronics Technology for Extreme-scale Computing (REPETE) workgroup. REPETE investigated new challenges in the area of HPC interconnect inspired by technology trends and challenges of vital importance to USG stakeholders. The REPETE Working group investigated two focus areas of interest to the USG: Socket Level Photonic IO and Cryogenic Photonic IO. The working group spanned industry, academia, and government, in research, development, product, and technology investment areas. The workgroup team focusing on current and future design challenges for socket level photonic IO began discussing technical challenges and current state of applying photonics to off-chip IO in April of 2019 through biweekly meetings that concluded in early September of 2019. The focus of these meetings was to discuss what technology exists for moving the conversion of electrical signaling to photonic signaling from the node (as is currently done) down to within the socket for off-chip IO. Areas discussed include: I/O Requirements and Trends at the Compute Socket for 2025 and Beyond; Current and Near-Term Copper Solutions for Off-Chip, Socket-Level Interconnect; Current Photonic Solutions for Off-Chip or Socket-Level Interconnect; Light Generation for Off-Chip, Socket-Level IO; Fabrication and Packaging of Photonic Integrated Circuits; All-Photonic Switching Technology; and Simulation of Photonic Interconnects.