Three regimes in the tribo-oxidation of high purity copper at temperatures of up to 150 $^\circ$C
Julia S. Raua, Oliver Schmidt, Reinhard Schneider, Christian Greiner

TL;DR
This study investigates how temperature influences tribo-oxidation of high-purity copper under sliding conditions, revealing three distinct regimes and the formation of CuO at elevated temperatures, which impacts surface properties.
Contribution
It provides new insights into temperature-dependent tribo-oxidation mechanisms and microstructural changes in high-purity copper during sliding contact.
Findings
Oxide layer formation occurs at 150°C but not at lower temperatures.
Increased tribo-oxidation depth and porosity with rising temperature.
CuO formation begins at temperatures ≥ 90°C.
Abstract
Surface oxidation of high-purity copper is accelerated under tribological loading. Tribo-oxide formation at room temperature is associated with diffusion processes along defects, such as dislocations or grain boundaries. Here, we embark on investigating the additional influence of temperature on the tribo-oxidation of copper. Dry, reciprocating sliding tests were performed with a variation of the sample temperature between 21 - 150 C. Microstructural changes were monitored and analyzed with state-of-the-art electron microscopy techniques. Oxide layer formation through thermal oxidation was observed for 150 C, but not for lower temperatures. As the temperature increases from room temperature up to 100 C, a significantly stronger tribo-oxidation into deeper material layers and an increase in the amount of formed pores and oxides was detected. Up to 75 C,…
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Taxonomy
TopicsMetal and Thin Film Mechanics · Copper Interconnects and Reliability · Diamond and Carbon-based Materials Research
