The design of quaternary eutectic solder by machine learning
Zhenhua Guo, Xintong Ren, Jiahua Jiang, Haoyang Liu, Yongjun Huo,, Xiuchen Zhao, K. N. Tu, and Yingxia Liu

TL;DR
This paper demonstrates how machine learning can effectively design quaternary eutectic solder alloys, accurately predicting compositions and eutectic points, thus accelerating development in electronic manufacturing.
Contribution
It introduces a machine learning approach for designing quaternary eutectic solder alloys, combining computational predictions with experimental validation.
Findings
Machine learning accurately predicted alloy compositions.
Experimental results closely matched ML predictions.
The approach accelerates eutectic solder development.
Abstract
In this paper, we obtain a Sn-Bi-In-Pb quaternary near eutectic alloy composition from machine learning model. The eutectic points and the alloy composition were evaluated and continuously improved by experimental input. The actual composition is near the result given by machine learning. We conclude that the application of machine learning in solder design has shown the potential to overcome the challenge in searching for the next generation eutectic solders, which will have a broad impact on the industry.
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Taxonomy
TopicsElectronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Aluminum Alloy Microstructure Properties
