Microstructural engineering of medium entropy NiCo(CrAl) alloy for enhanced room and high-temperature mechanical properties

TL;DR

This study develops a medium entropy NiCo(CrAl) alloy with enhanced room and high-temperature mechanical properties through microstructural engineering involving partial recrystallization and precipitation strengthening, demonstrating superior strength and stability.

Contribution

It introduces a novel microstructural design combining partial recrystallization and precipitate strengthening in a medium entropy alloy, improving its high-temperature performance.

Findings

Achieves 1030 MPa yield stress at room temperature with 32% elongation.

Retains up to 910 MPa yield stress at 670°C.

Exhibits exceptional microstructural stability at 700°C.

Abstract

This work demonstrates the development of a strong and ductile medium entropy alloy by employing conventional alloying and thermomechanical processing to induce partial recrystallization (PR) and precipitation strengthening in the microstructure. The combined usage of electron microscopy and atom probe tomography reveals the sequence of microstructural evolution during the process. First, the cold working of homogenized alloy resulted in a highly deformed microstructure. On annealing at 700{\deg}C, B2 ordered precipitates heterogeneously nucleate on the highly misoriented sites. These B2 promotes particle stimulated nucleation (PSN) of new recrystallized strain-free grains. The migration of recrystallized grain boundaries leads to discontinuous precipitation of L12 ordered regions in highly dense lamellae structures. Atomic-scale compositional analysis reveals a significant amount of Ni confined to the GB regions between B2 and L12 precipitates, indicating Ni as a rate-controlling element for coarsening the microstructure. On 20 hours of annealing, the alloy comprises a composite microstructure of soft recrystallized and hard non-recrystallized zones, B2 particles at the grain boundaries (GBs), and coherent L12 precipitates inside the grains. The B2 pins the GB movement during recrystallization while the latter provides high strength. The microstructure results in a 0.2% yield stress (YS) value of 1030 MPa with 32% elongation at ambient temperature and retains up to 910 MPa at 670{\deg}C. Also, it shows exceptional microstructural stability at 700 {\deg}C and resistance to deformation at high temperatures up to 770{\deg}C. Examination of deformed microstructure reveals excessive twinning, formation of stacking faults, shearing of L12 precipitates, and accumulation of dislocations at around the B2 precipitates and GBs attributed to high strain hardening of the alloy.