Caloric Micro-cooling: Numerical modelling and parametric investigation
Jan Kalizan, Jaka Tu\v{s}ek

TL;DR
This paper presents a numerical analysis of caloric micro-cooling systems using elastocaloric and electrocaloric materials, demonstrating their potential to effectively cool electronic components below room temperature with high efficiency.
Contribution
It provides a comprehensive numerical investigation of caloric micro-cooling, highlighting its limits, potential, and the influence of heat sink capabilities on cooling performance.
Findings
Caloric micro-cooling can lower electronic component temperatures below room temperature.
The system achieves COP values exceeding 10.
Cooling capacity depends on heat sink and heat transfer capabilities.
Abstract
Cooling systems based on the caloric effects of ferroic materials show high potential for various cooling and heat-pumping applications due to their potentially high efficiencies and the lack of any environmentally hazardous refrigerants. One of such applications that has recently gained the attention of the scientific community is micro-cooling, which can be applied for hot-spot cooling and thermal management in electronic components. In this study a comprehensive numerical analysis of a caloric micro-cooling system using elastocaloric and electrocaloric materials was performed in order to investigate the limits and potential of this technology. We demonstrated that a caloric micro-cooling system is able to cool down the electronic component below room temperature or at least stabilize it at lower temperatures compared to the case when only the heat sink is applied in an efficient way…
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