Magnetic-field assisted laser ablation of silicon
M. Sch\"afer (1), P.N. Terekhin (2), Y. Kang (1), G. Torosyan (1), X., del Arco Fargas (2), S. Hirtle (2), B. Rethfeld (2), J.A. L'huillier (1), ((1) Photonik-Zentrum Kaiserslautern e.V., (2) TU Kaiserslautern)

TL;DR
This study investigates how an external magnetic field influences ultrashort laser ablation of silicon, demonstrating improved processing quality and controllability of surface structures, advancing laser micromachining techniques.
Contribution
It provides experimental evidence that magnetic fields can enhance laser ablation quality and control surface pattern formation in silicon.
Findings
Magnetic field improves ablation quality and efficiency.
Magnetic field affects formation of laser-induced periodic surface structures.
Results enable more controllable ultrafast laser micromachining.
Abstract
Understanding and manipulation of the laser processing quality during the ablation of solids have crucial importance from fundamental and industrial perspectives. Here we have studied the effect of external magnetic field on the micro-material processing of silicon by ultrashort laser pulses. It was found experimentally that such a field directed along the laser beam improves the quality and efficiency of the material removal. Additionally, we observe that the formation of laser-induced periodic surface structures (LIPSS) in a multi-pulse regime is affected by the external magnetic field. Our results open a route towards efficient and controllable ultrafast laser micromachining.
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