Topology for Substrate Routing in Semiconductor Package Design

TL;DR

This paper introduces a topological approach to substrate routing in semiconductor design, transforming complex layer routing into a simplified circle-connection problem to improve efficiency.

Contribution

It presents a novel topological transformation method using the Circular Frame to enhance substrate routing in semiconductor packages.

Findings

Competitive with grid-based routing algorithms

Simplifies complex routing problems

Uses topological transformation for improved efficiency

Abstract

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms.