Effect of base-pair sequence on B-DNA thermal conductivity
Vignesh Mahalingam, Dineshkumar Harursampath

TL;DR
This study uses molecular dynamics simulations to explore how different DNA base-pair sequences affect thermal conductivity, revealing insights relevant for DNA-based thermal device engineering.
Contribution
It systematically investigates the influence of various DNA sequences and lengths on thermal conductivity, including mixed sequences, using RNEMD simulations, which is novel in this context.
Findings
No significant divergence in thermal conductivity at lengths up to 80 base pairs.
Short encapsulated AT sequences within CG sequences increase thermal conductivity.
Thermal conductivity follows a power law with length, but does not violate Fourier law at studied lengths.
Abstract
The thermal conductivity of double-stranded (ds) B-DNA was systematically investigated using classical molecular dynamics (MD) simulations. The effect of changing base-pairs on the thermal conductivity of dsDNA, needed investigation at a molecular level. Hence, four sequences, viz. poly(A), poly(G), poly(CG) and poly(AT) were initially analysed in this work. Firstly, length of these sequences was varied from 4-40 base-pairs (bp) at 300 K and the respective thermal conductivity () was computed. Secondly, the temperature dependent thermal conductivities between 100 K and 400 K were obtained in 50 K steps at 28 bp length. The M\"{u}ller-Plathe reverse non-equilibrium molecular dynamics (RNEMD) was employed to set a thermal gradient and obtain all thermal conductivities in this work. Moreover, mixed sequences using AT and CG sequencces, namely (n=3-7),…
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