The role of flexural coupling in heat dissipation from a two-dimensional layered material to its hexagonal boron nitride substrate
Zhun-Yong Ong, Gang Zhang, Yong-Wei Zhang

TL;DR
This paper develops an elasticity-based model to analyze phonon-mediated heat dissipation from 2D layered materials to h-BN substrates, highlighting the importance of flexural modes and anisotropic properties for thermal management.
Contribution
The study introduces a semi-analytical stack model for phonon heat transfer that incorporates flexural coupling and compares it with atomistic models, advancing understanding of thermal boundary conductance in 2D heterostructures.
Findings
h-BN outperforms a-SiO2 in heat dissipation for MoS2 at large N
Flexural modes significantly influence thermal boundary conductance
Anisotropic elastic properties of h-BN affect heat transfer efficiency
Abstract
Understanding the limits of phononic heat dissipation from a two-dimensional layered material (2DLM) to its hexagonal boron nitride (h-BN) substrate and how it varies with the structure of the 2DLM is important for the design and thermal management of h-BN-supported nanoelectronic devices. We formulate an elasticity-based theory to model the phonon-mediated heat dissipation between a 2DLM and its h-BN substrate. By treating the h-BN substrate as a semi-infinite stack of harmonically coupled thin plates, we obtain semi-analytical expressions for the thermal boundary conductance (TBC) and interfacial phonon transmission spectrum. We evaluate the temperature-dependent TBC of the -layer 2DLM (graphene or MoS) on different common substrates (h-BN vs. a-SiO) at different values of . The results suggest that h-BN is substantially more effective for heat dissipation from…
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Taxonomy
TopicsThermal properties of materials · Smart Materials for Construction · Thermal Radiation and Cooling Technologies
