Current Overview of Statistical Fiber Bundles Model and Its Application to Physics-based Reliability Analysis of Thin-film Dielectrics
James U. Gleaton, David Han, James D. Lynch, Hon Keung Tony Ng and, Fabrizio Ruggeri

TL;DR
This paper reviews statistical fiber bundle models and their application to physics-based reliability analysis of thin-film dielectrics, introducing new models and analyzing breakdown distributions in circuit systems.
Contribution
It provides a comprehensive overview of fiber bundle models, proposes new assumptions, and applies the formalism to dielectric breakdown in circuit reliability analysis.
Findings
Derived load-sharing rules from electrical laws for circuit breakdowns.
Obtained breakdown distribution and Gibbs measure for series circuits.
Compared various breakdown distributions and analyzed size effects in reliability systems.
Abstract
In this paper, we present a critical overview of statistical fiber bundles models. We discuss relevant aspects, like assumptions and consequences stemming from models in the literature and propose new ones. This is accomplished by concentrating on both the physical and statistical aspects of a specific load-sharing example, the breakdown (BD) for circuits of capacitors and related dielectrics. For series and parallel/series circuits (series/parallel reliability systems) of ordinary capacitors, the load-sharing rules are derived from the electrical laws. This with the BD formalism is then used to obtain the BD distribution of the circuit. The BD distribution and Gibbs measure are given for a series circuit and the size effects are illustrated for simulations of series and parallel/series circuits. This is related to the finite weakest link adjustments for the BD distribution that arise…
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Taxonomy
TopicsHigh voltage insulation and dielectric phenomena · Semiconductor materials and devices · Electrostatic Discharge in Electronics
