Synthesis of Three-Dimensionally Interconnected Hexagonal Boron Nitride Networked Cu-Ni Composite

TL;DR

This paper reports the in situ synthesis of a 3D interconnected hexagonal boron nitride network within a Cu-Ni composite, enhancing its resistance to mechanical, thermal, and chemical attacks, with potential applications in biomedicine and energy storage.

Contribution

A novel two-step process for creating a 3D hBN network in Cu-Ni composites using MOCVD, enabling improved material properties and new application possibilities.

Findings

Successful synthesis of 3D hBN network within Cu-Ni composite.

The hBN network enhances resistance to mechanical, thermal, and chemical attacks.

Extracted foam-like hBN has potential in biomedicine and energy storage.

Abstract

A three-dimensionally interconnected hexagonal boron nitride (3Di-hBN) networked Cu-Ni (3Di-hBN-Cu-Ni) composite was successfully synthesized in situ using a simple two-step process which involved the compaction of mixed Cu-Ni powders (70 wt.% Cu and 30 wt.% Ni) into a disc followed by metal-organic chemical vapor deposition (MOCVD) process at 1000{\deg}C. During MOCVD, the Cu-Ni alloy grains acted as a template for the growth of hexagonal boron nitride (hBN) while decaborane and ammonia were used as precursors for boron and nitrogen, respectively. Boron and nitrogen atoms diffused into the Cu-Ni solution during the MOCVD process, precipitated out and grew along the Cu-Ni interfaces upon cooling. It was demonstrated that pores were generated during the sintering process and then filled by bulk hBN during the MOCVD process (indicated by energy dispersive spectroscopy) as the pores also served as catalytic sites for the nucleation and growth of hBN. Optical microscopy examination indicated that there was a minimum amount of bulk hBN at certain compaction pressure (280 MPa) and sintering time (30 min). Scanning electron microscopy and transmission electron microscopy revealed that the interconnected network of hBN layers surrounding the Cu-Ni grains was developed in the 3Di-hBN-Cu-Ni composite. This 3Di-hBN network is expected to enhance the resistance of the 3Di-hBN-Cu-Ni composite against mechanical, thermal and chemical attacks. Moreover, foam-like 3Di-hBN was extracted from 3Di-hBN-Cu-Ni composite which could be further applied in the fields of biomedicine and energy storage.