A Case for 3D Integrated System Design for Neuromorphic Computing & AI Applications
Eren Kurshan, Hai Li, Mingoo Seok, Yuan Xie

TL;DR
This paper discusses how 3D integration technology can enhance neuromorphic chip design for AI, offering performance, energy efficiency, and architectural benefits despite current challenges.
Contribution
It provides a comprehensive overview of 3D integration opportunities, challenges, and future potential in neuromorphic computing architectures for AI applications.
Findings
3D integration offers significant advantages for neuromorphic chip design.
Emerging opportunities include improved performance and design flexibility.
Obstacles include understanding brain architecture and manufacturing challenges.
Abstract
Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency challenges faced during the implementation process. To address these challenges, there has been growing interest in neuromorphic chips. Neuromorphic computing relies on non von Neumann architectures as well as novel devices, circuits and manufacturing technologies to mimic the human brain. Among such technologies, 3D integration is an important enabler for AI hardware and the continuation of the scaling laws. In this paper, we overview the unique opportunities 3D integration provides in neuromorphic chip design, discuss the emerging opportunities in next generation neuromorphic architectures and review the obstacles. Neuromorphic architectures, which…
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Taxonomy
TopicsAdvanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Modular Robots and Swarm Intelligence
