The Design of Dual Band Stacked Metasurfaces Using Integral Equations

TL;DR

This paper presents an integral equation-based method for designing dual band stacked metasurfaces that generate collimated beams at specified angles, involving homogenization, impedance modeling, and optimization for fabrication.

Contribution

It introduces a novel three-phase design process combining integral equations, impedance transformation, and patterning for dual band metasurfaces.

Findings

Successfully designed two dual band stacked metasurfaces

Achieved desired beam collimation at specified angles

Validated designs with full-wave simulations

Abstract

An integral equation-based approach for the design of dual band stacked metasurfaces which are invariant in one-dimension is presented. The stacked metasurface will generate collimated beams at desired angles in each band upon reflection. The conductor-backed stacked metasurface consists of two metasurfaces (a patterned metallic cladding supported by a dielectric spacer) stacked one upon the other. The stacked metasurface is designed in three phases. First the patterned metallic cladding of each metasurface is homogenized and modeled as an inhomogeneous impedance sheet. An Electric Field Integral Equation (EFIE) is written to model the mutual coupling between the homogenized elements within each metasurface, and from metasurface to metasurface. The EFIE is transformed into matrix equations by the method of moments. The nonlinear matrix equations are solved at both bands iteratively resulting in dual band complex-valued impedance sheets. In the second phase, optimization is applied to transform these complex-valued impedance sheets into purely reactive sheets suitable for printed circuit board fabrication by introducing surface waves. In the third phase, the metallic claddings of each metasurface are patterned for full-wave simulation of the dual band stacked metasurface. Using this approach, two dual band stacked metasurfaces are designed