Phonon heat conduction in Al1-xScxN thin films
Chao Yuan, Mingyo Park, Yue Zheng, Jingjing Shi, Rytis Dargis, Samuel, Graham, Azadeh Ansari

TL;DR
This study investigates phonon scattering and thermal conductivity in Al1-xScxN thin films, revealing how alloy composition and temperature influence heat conduction, with implications for acoustic device performance.
Contribution
First comprehensive analysis of phonon scattering and thermal conductivity in Al1-xScxN alloys with detailed modeling of scattering mechanisms.
Findings
Thermal conductivity decreases with increasing Sc content.
Thermal conductivity increases below 200K and plateaus above 200K.
Alloy scattering mainly caused by strain-field differences, not atomic mass differences.
Abstract
Aluminum scandium nitride alloy (Al1-xScxN) is regarded as a promising material for high-performance acoustic devices used in wireless communication systems. Phonon scattering and heat conduction processes govern the energy dissipation in acoustic resonators, ultimately determining their performance quality. This work reports, for the first time, on phonon scattering processes and thermal conductivity in Al1-xScxN alloys with the Sc content (x) up to 0.26. The thermal conductivity measured presents a descending trend with increasing x. Temperature-dependent measurements show an increase in thermal conductivity as the temperature increases at temperatures below 200K, followed by a plateau at higher temperatures (T> 200K). Application of a virtual crystal phonon conduction model allows us to elucidate the effects of boundary and alloy scattering on the observed thermal conductivity…
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Taxonomy
TopicsThermal properties of materials · Acoustic Wave Resonator Technologies · GaN-based semiconductor devices and materials
