Solid-phase silicon homoepitaxy via shear-induced amorphization and recrystallization
Thomas Reichenbach, Gianpietro Moras, Lars Pastewka, Michael Moseler

TL;DR
This paper introduces a novel solid-phase silicon homoepitaxial growth method called triboepitaxy, achieved through shear-induced amorphization and recrystallization at low temperatures, enabling precise, pattern-free nanostructure fabrication.
Contribution
It demonstrates that crystalline silicon nanofilms can be directly deposited via shear-induced processes without substrate pre-patterning, offering a new mechanical approach for nanofabrication.
Findings
Triboepitaxy enables controlled silicon nanofilm growth.
Shear-induced amorphization and recrystallization occur at low temperature.
Growth direction can be manipulated by crystallographic orientation.
Abstract
The development of epitaxy techniques for localized growth of crystalline silicon nanofilms and nanostructures has been crucial to recent advances in electronics and photonics. A precise definition of the crystal growth location, however, requires elaborate pre-epitaxy processes for substrate patterning. Our molecular dynamics simulations reveal that homoepitaxial silicon nanofilms can be directly deposited by a crystalline silicon tip rubbing against the substrate, thus enabling geometrically controlled crystal growth with no need for substrate pre-patterning. We name this solid-phase epitaxial growth triboepitaxy as it solely relies on shear-induced amorphization and recrystallization that occur even at low temperature at the sliding interface between two silicon crystals. The interplay between the two concomitant, shear-induced processes is responsible for the formation of an…
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