Memory effect of external oscillation on residual stress in a paste

TL;DR

This study numerically explores how external oscillations induce residual stress in a paste, revealing that the paste memorizes the oscillation as plastic deformation, affecting crack patterns after drying.

Contribution

It introduces a numerical model showing how oscillation cycles influence residual stress distribution and crack pattern formation in paste materials.

Findings

Residual stress depends on the number of oscillation cycles.

Increased cycles enhance symmetry in stress distribution.

Numerical results align with experimental crack patterns.

Abstract

We numerically investigate the stress distribution of a paste when an external oscillation is applied. The paste memorizes the oscillation as plastic deformation. Due to the plastic deformation, the residual stress remains after the oscillation, where the residual stress distribution depends on the number of cycles in the oscillation. As this number increases, the symmetry of the stress distribution is enhanced, which is consistent with the crack patterns observed in the experiments using a drying paste.