Thermoelectric cooling properties of a quantum Hall Corbino device

TL;DR

This paper investigates the thermoelectric cooling capabilities of a quantum Hall Corbino device, using experimental conductance data to analyze its efficiency and cooling power across various conditions.

Contribution

It introduces a method to infer the transmission function from conductance data and predicts the device's cooling performance beyond linear response regimes.

Findings

Effective cooling performance predicted at multiple parameter regimes.

Transport occurs in the diffusive regime without significant electron-phonon effects.

Cooling power and efficiency depend on filling factors and temperature biases.

Abstract

We analyze the thermoelectric cooling properties of a Corbino device in the quantum Hall regime on the basis of experimental data of electrical conductance. We focus on the cooling power and the coefficient of performance within and beyond linear response. Thermovoltage measurements in this device reported in {\em Phys. Rev. Applied, {\bf 14} 034019 (2020)} indicated that the transport takes place in the diffusive regime, without signatures of effects due to the electron-phonon interaction in a wide range of temperatures and filling factors. In this regime, the heat and charge currents by electrons can be described by a single transmission function. We infer this function from experimental data of conductance measurements and we calculate the cooling power and the coefficient of performance for a wide range of filling factors and temperatures, as functions of the thermal and electrical biases. We predict an interesting cooling performance in several parameter regimes.