Quantitative measurement of the thermal contact resistance between a glass microsphere and a plate

TL;DR

This study develops a precise method using a modified scanning thermal microscope to measure the thermal contact resistance between a glass microsphere and a plate, accounting for environmental effects and contact conditions.

Contribution

It introduces a quantitative approach to measure microscale thermal contact resistance in different environments without complex simulations.

Findings

Measured contact resistance in vacuum: (1.4 ± 0.18)×10^7 K.W^{-1}

Estimated contact resistance in air: (1.2 ± 0.46)×10^7 K.W^{-1}

Determined effective sphere radius: 36 ± 4 nm

Abstract

Accurate measurements of the thermal resistance between micro-objects made of insulating materials are complex because of their small size, low conductivity, and the presence of various ill-defined gaps. We address this issue using a modified scanning thermal microscope operating in vacuum and in air. The sphere-plate geometry is considered. Under controlled heating power, we measure the temperature on top of a glass microsphere glued to the probe as it approaches a glass plate at room temperature with nanometer accuracy. In vacuum, a jump is observed at contact. From this jump in temperature and the modeling of the thermal resistance of a sphere, the sphere-plate contact resistance $ R_K=(1.4 \pm 0.18)\times10^7 \ \mathrm{K.W^{-1}}$ and effective radius $r=(36 \pm 4)$ nm are obtained. In air, the temperature on top of the sphere shows a decrease starting from a sphere-plate distance of 200 $\mathrm{\mu m}$. A jump is also observed at contact, with a reduced amplitude. The sphere-plate coupling out of contact can be described by the resistance shape factor of a sphere in front of a plate in air, placed in a circuit involving a series and a parallel resistance that are determined by fitting the approach curve. The contact resistance in air $R^*_K=(1.2 \pm 0.46)\times 10^7 \ \mathrm{K.W^{-1}}$ is then estimated from the temperature jump. The method is quantitative without requiring any tedious multiple-scale numerical simulation, and is versatile to describe the coupling between micro-objects from large distances to contact in various environments.