Stick-slip phenomena and Schallamach waves captured using reversible cohesive elements
Evelyne Ringoot, Thibault Roch, Jean-Fran\c{c}ois Molinari, Thierry J., Massart, Tal Cohen

TL;DR
This paper introduces a reversible cohesive element-based finite element model that effectively captures stick-slip phenomena and Schallamach waves during surface peeling, providing insights into detachment behaviors across scales.
Contribution
The study develops a novel computational framework using customized reversible cohesive elements to simulate complex peeling and detachment phenomena, including snap-through instabilities and wave formations.
Findings
Periodic reattachment linked to Schallamach waves
Stick-slip behavior correlates with interface damage localization
Model captures experimentally observed peeling phenomena
Abstract
Reversibility is of paramount importance in the correct representation of surface peeling in various physical settings, ranging from motility in nature, to gripping devices in robotic applications, and even to sliding of tectonic plates. Modeling the detachment-reattachment sequence, known as stick-slip, imposes several challenges in a continuum framework. Here we exploit customized reversible cohesive elements in a hybrid finite element model that can handle occurrence of snap-through instabilities. The simulations capture various peeling phenomena that emerge in experimental observations, where layers are pulled from a flat, rigid substrate in the direction parallel to the surface. For long layers, periodicity in reattachment is shown to develop and is linked to the concept of Schallamach waves. Further, the connection between surface properties and stick-slip behavior is…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
