Interface study of thermally driven chemical kinetics involved in Ti/Si3N4 based metal-substrate assembly by X-ray photoelectron spectroscopy
Sachin Yadav, Sangeeta Sahoo

TL;DR
This study investigates the chemical reactions and phase formations in Ti/Si3N4/Si systems during high-temperature annealing using X-ray photoelectron spectroscopy, revealing temperature-dependent formation of TiN and silicide phases.
Contribution
It provides detailed insights into the thermally driven chemical kinetics and phase evolution in Ti/Si3N4 systems, highlighting temperature effects on silicide and nitride formation.
Findings
TiN forms predominantly at all annealing temperatures.
Silicide formation peaks at 780°C.
Higher temperatures favor elemental Si over silicide.
Abstract
Diffusion mediated interaction in metal-substrate assembly during high temperature annealing leads to possible formation of new composite materials. Here, sputtered grown Ti films on Si3N4/Si substrate has been reported to produce titanium nitride and silicide based binary composites while undergoing high vacuum annealing process at temperatures 650{\deg}C and above. Diffusion of thermally decomposed Si and N atoms from Si3N4 and their subsequent chemical reaction with Ti have been probed by X-ray photo electron spectroscopy. For annealing at 800{\deg}C and above, most of the Si atoms show preferences to stay in elemental form rather than developing silicide phase with Ti. Whereas at lower annealing temperature, silicide becomes the dominant phase for decomposed Si atoms. However, N atoms react promptly with Ti and form TiN which appears as the majority phase for each of the studied…
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