Evaluation of dynamic fracture toughness of a bonded bi-material interface subject to high-strain-rate shearing using digital image correlation
Tomohisa Kojima, Yuta Kimura, Shuichi Arikawa, Mitsuo Notomi

TL;DR
This study evaluates the dynamic fracture toughness of a bonded aluminum/PMMA interface under high-strain-rate shear using digital image correlation, revealing fracture modes and validating a new measurement method.
Contribution
It introduces a novel approach combining DIC and stress intensity factor analysis to assess interfacial fracture toughness at high strain rates.
Findings
Mode II fracture occurs with shorter cracks.
Mode I and II fractures appear with longer cracks.
The proposed method yields consistent stress intensity factors.
Abstract
High-strain-rate shear tests were conducted on a three-layered bonded test piece comprising a central aluminum layer with PMMA resin layers bonded on both sides. Upon calculating the displacement field and the strain field using digital image correlation (DIC), the crack tip was located, and the fracture toughness was evaluated at the Aluminum/PMMA bonding interface. As a result of the DIC, it was possible to determine the process by which 1) the elastic stress wave propagated to the aluminum section, 2) the wave was transmitted to the PMMA section, and 3) the crack developed at the interface. The tip of the crack was identified using displacement distributions obtained using DIC. The fracture toughness of the interface was evaluated using the stress intensity factor. The true interfacial stress was calculated by correcting the strain value at the interface obtained using DIC. The…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
