Isotopic enrichment of silicon by high fluence $^{28}$Si$^-$ ion implantation
D. Holmes, B. C. Johnson, C. Chua, B. Voisin, S. Kocsis, S. Rubanov,, S. G. Robson, J. C. McCallum, D. R McCamey, S. Rogge, D. N. Jamieson

TL;DR
This study demonstrates a high-fluence $^{28}$Si$^-$ ion implantation method to enrich silicon with $^{28}$Si, reducing $^{29}$Si isotope concentration and enhancing coherence times for silicon-based spin qubits.
Contribution
It introduces a novel high-fluence ion sputtering technique for isotopic enrichment of silicon, suitable for quantum device fabrication.
Findings
Achieved $^{29}$Si depletion to 250 ppm in surface layers.
Confirmed donor activation and extended coherence times in enriched silicon.
Produced single-crystal enriched silicon layers approximately 100 nm thick.
Abstract
Spins in the `semiconductor vacuum' of silicon-28 (Si) are suitable qubit candidates due to their long coherence times. An isotopically purified substrate of Si is required to limit the decoherence pathway caused by magnetic perturbations from surrounding Si nuclear spins (I=1/2), present in natural Si (nat Si) at an abundance of 4.67%. We isotopically enrich surface layers of nat Si by sputtering using high fluence Si implantation. Phosphorus (P) donors implanted into one such Si layer with ~3000 ppm Si, produced by implanting 30 keV Si ions at a fluence of 4x10^18 cm^-2, were measured with pulsed electron spin resonance, confirming successful donor activation upon annealing. The mono-exponential decay of the Hahn echo signal indicates a depletion of Si. A coherence time of T2 = 285 +/- 14 us is extracted, which is longer…
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