A Review of 5G Front-End Systems Package Integration

TL;DR

This paper reviews advances in 5G front-end system packaging, focusing on heterogeneous 3D integration techniques essential for meeting high data rate and low latency requirements.

Contribution

It provides a comprehensive overview of key packaging technologies and their role in enabling 5G RF front-end modules, highlighting recent innovations and challenges.

Findings

Heterogeneous 3D integration improves component density and performance.

Packaging advances address millimeter-wave low-loss and impedance requirements.

Review of key building blocks and technological progress in 5G systems.

Abstract

Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.