Thermal Stress Analysis of Liquid-Cooled 3D-ICs

TL;DR

This paper analyzes thermal stress in liquid-cooled 3D-ICs, revealing that certain cooling methods can induce stresses exceeding material limits, risking chip failure and impacting reliability.

Contribution

It provides a detailed thermal stress analysis of 3D-ICs with different cooling liquids, highlighting potential failure risks due to thermal stress.

Findings

LN cooling causes the highest thermal stress, exceeding aluminum tensile strength.

Thermal stress increases with chip temperature, risking chip failure.

Cooling methods significantly impact the thermal stress and reliability of 3D-ICs.

Abstract

It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal stress can also pose severe problems, even after cooling the chip. This study investigates thermal stress resulting from a 3D-IC hot spot with 20 W power dissipation. The IC is cooled using SiO2 and diamond cooling blocks. The study is performed using three cooling liquids: water, Freon (R22), and Liquid Nitrogen (LN). As expected, the study shows that metal layers on the chip suffer from high thermal stress due to rising the chip temperature to values higher than the room temperature. It is also noticed that the stress becomes more severe, if cooling is done using LN. In fact, the stress exceeded the maximum tensile strength of aluminum, which means failure of the chip. This indicates that cooling 3D-IC may not ensure acceptable operation or reliability. Thermal stress must be investigated at both high and low temperatures to ensure high performance and acceptable reliability.