Expectation-Maximization Algorithm for Identification of Mesh-based Compartment Thermal Model of Power Modules
Jakub \v{S}ev\v{c}\'ik, V\'aclav \v{S}m\'idl, Ond\v{r}ej Straka

TL;DR
This paper introduces a structured mesh-based compartment thermal model for power modules, utilizing an Expectation-Maximization algorithm to identify shared parameters from limited temperature data, reducing measurement requirements.
Contribution
It presents a novel structured compartment model with shared parameters and regularization, enabling temperature prediction with fewer measurements compared to previous methods.
Findings
Model accurately predicts unmeasured temperatures.
Parameter sharing improves identification robustness.
Simulation results demonstrate effectiveness on synthetic data.
Abstract
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding undesirable over-temperatures and thus improve reliability of the module. Commonly used thermal models can be based on detailed expert knowledge of the device's physical structure or on precise and complete temperature distribution measurements. The latter approach is more often used in the industry. Recently, we have proposed a linear time invariant state-space thermal model based on a compartment representation and its identification procedure that is based on the Expectation-Maximization algorithm from incomplete temperature data. However, the model still requires to measure temperatures of all active elements. In this contribution, we aim to relax the…
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Taxonomy
TopicsSilicon Carbide Semiconductor Technologies · Silicon and Solar Cell Technologies · VLSI and FPGA Design Techniques
