High-yield wafer-scale fabrication of ultralow-loss, dispersion-engineered silicon nitride photonic circuits
Junqiu Liu, Guanhao Huang, Rui Ning Wang, Jijun He, Arslan S. Raja,, Tianyi Liu, Nils J. Engelsen, and Tobias J. Kippenberg

TL;DR
This paper presents a wafer-scale fabrication method for silicon nitride photonic circuits achieving ultralow optical losses, high yield, and large-scale integration suitable for advanced nonlinear photonics applications.
Contribution
The authors develop a fabrication process that produces high-quality, dispersion-engineered silicon nitride microresonators with ultralow losses and high yield on wafer-scale, enabling meter-scale photonic circuits.
Findings
Mean Q factor exceeds 30 million
Linear propagation loss of 1.0 dB/m over full wafers
Intrinsic absorption-limited Q factor exceeds a billion
Abstract
Low-loss photonic integrated circuits (PIC) and microresonators have enabled novel applications ranging from narrow-linewidth lasers, microwave photonics, to chip-scale optical frequency combs and quantum frequency conversion. To translate these results into a widespread technology, attaining ultralow optical losses with established foundry manufacturing is critical. Recent advances in fabrication of integrated Si3N4 photonics have shown that ultralow-loss, dispersion-engineered microresonators can be attained at die-level throughput. For emerging nonlinear applications such as integrated travelling-wave parametric amplifiers and mode-locked lasers, PICs of length scales of up to a meter are required, placing stringent demands on yield and performance that have not been met with current fabrication techniques. Here we overcome these challenges and demonstrate a fabrication technology…
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