The refined EUV mask model

TL;DR

This paper presents a highly detailed and experimentally validated model of an EUV mask stack, improving simulation accuracy for high-NA EUV lithography by combining EUV and X-ray reflectivity data with free-form interface analysis.

Contribution

The paper introduces a novel combined analysis method that derives a high-resolution, experimentally-based multilayer model for EUV masks, enhancing simulation precision.

Findings

High-resolution multilayer profiles with 0.25nm layers

Improved accuracy in EUV reflectivity modeling

Enhanced EUV lithography simulation performance

Abstract

A refined model of an extreme ultraviolet (EUV) mask stack consisting of the Mo/Si multilayer coated by a Ru protective layer and a TaBN/TaBO absorber layer was developed to facilitate accurate simulations of EUV mask performance for high-NA EUV photo-lithography (EUVL) imaging. The model is derived by combined analysis of the measured EUV and X-ray reflectivity of a state-of-the-art mask blank. These two sets of measurements were analyzed using a combined free-form analysis procedure that delivers high-resolution X-ray and EUV optical constant depth profiles based on self-adapted sets of sublayers as thin as 0.25nm providing a more accurate description of the reflectivity than obtained from only EUV reflectivity. 'Free-form analysis' means that the shape of the layer-interfaces in the model is determined experimentally and is not given a priori by the structure model. To reduce the numerical effort for EUV imaging simulations a low-resolution model of the multilayer and absorber stack with sublayer thicknesses larger than 2nm, that fits to only the EUV reflectance, was derived from the high-resolution model. Rigorous high-NA EUVL simulations were done to compare the performance of the new model to our previous work.