A Novel Visual Fault Detection and Classification System for Semiconductor Manufacturing Using Stacked Hybrid Convolutional Neural Networks
Tobias Schlosser, Frederik Beuth, Michael Friedrich, and Danny Kowerko

TL;DR
This paper presents a novel multi-stage deep neural network system, called SH-CNN, for highly detailed defect detection and classification in semiconductor manufacturing, improving accuracy and efficiency over existing methods.
Contribution
It introduces a stacked hybrid CNN architecture inspired by visual attention mechanisms, capable of detecting minute defect structures in high-resolution images.
Findings
SH-CNN outperforms current learning-based inspection methods
The multi-stage approach enables early defect pattern elimination
Focus on detail levels improves classification accuracy
Abstract
Automated visual inspection in the semiconductor industry aims to detect and classify manufacturing defects utilizing modern image processing techniques. While an earliest possible detection of defect patterns allows quality control and automation of manufacturing chains, manufacturers benefit from an increased yield and reduced manufacturing costs. Since classical image processing systems are limited in their ability to detect novel defect patterns, and machine learning approaches often involve a tremendous amount of computational effort, this contribution introduces a novel deep neural network based hybrid approach. Unlike classical deep neural networks, a multi-stage system allows the detection and classification of the finest structures in pixel size within high-resolution imagery. Consisting of stacked hybrid convolutional neural networks (SH-CNN) and inspired by current approaches…
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