Experimental Observation of High Intrinsic Thermal Conductivity of AlN
Zhe Cheng, Yee Rui Koh, Abdullah Mamun, Jingjing Shi, Tingyu Bai,, Kenny Huynh, Luke Yates, Zeyu Liu, Ruiyang Li, Eungkyu Lee, Michael Liao,, Yekan Wang, Hsuan Ming Yu, Maki Kushimoto, Tengfei Luo, Mark S. Goorsky,, Patrick E. Hopkins, Hiroshi Amano, Asif Khan, Samuel Graham

TL;DR
This study experimentally demonstrates that high-quality bulk AlN exhibits intrinsic thermal conductivity values aligning with theoretical predictions, highlighting its potential for advanced thermal management in electronic devices.
Contribution
First experimental observation of intrinsic thermal conductivity in bulk AlN matching theoretical calculations, achieved through high-quality MOCVD growth.
Findings
Measured thermal conductivity of AlN matches density functional theory predictions.
Commercial AlN substrates show lower thermal conductivity due to impurities.
High-quality AlN can significantly improve thermal management in devices.
Abstract
AlN is an ultra-wide bandgap semiconductor which has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is the key for stable device performance and allowing for long lifetimes. AlN, with its potentially high thermal conductivity, can play an important role serving as a dielectric layer, growth substrate, and heat spreader to improve device performance. However, the intrinsic high thermal conductivity of bulk AlN predicted by theoretical calculations has not been experimentally observed because of the difficulty in producing materials with low vacancy and impurity levels, and other associated defect complexes in AlN which can decrease the thermal conductivity. This work reports the growth of thick AlN layers by MOCVD with an air-pocketed AlN layer and the first experimental observation of intrinsic thermal…
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