Electrical Characterization of 180 nm ATLASPix2 HV-CMOS Monolithic Prototypes for the High-Luminosity LHC
D M S Sultan, S. Gonzalez-Sevilla, D. Ferrere, G. Iacobucci, E., Zaffaroni, W. Wong, M. Kiehn, and, M. Benoit

TL;DR
This study evaluates the electrical performance of 180 nm HV-CMOS ATLASPix2 prototypes for high-luminosity collider tracking, focusing on breakdown voltage, irradiation effects, and annealing behavior to ensure reliable operation.
Contribution
It provides the first detailed characterization of ATLASPix2 HV-CMOS prototypes, including irradiation effects and annealing, advancing the development of radiation-hard sensors for high-energy physics.
Findings
ATLASPix2 prototypes show a breakdown voltage >100 V before irradiation.
Neutron irradiation reduces breakdown voltage but devices remain operable at high voltages.
Annealing improves breakdown voltage and reduces damage effects.
Abstract
We report on the experimental study made on a successive prototype of High-Voltage CMOS (HV-CMOS) ATLASPix2 sensor for the tracking detector application, developed with 180 nm feature size. These sensors are to qualify mainly the peripheral data processing blocks (e.g. Command Decoder, Trigger Buffer, etc.). It is a smaller version of 24 X 36 pixelated sensor in comparison to the earlier generation of ATLASPix1 fabricated in both ams AG, Austria, and TSI Semiconductors, USA. While ams produced ATLASPix2 showed breakdown voltage 50 V in nonirradiated condition as it was seen on its predecessors ATLASpix1, TSI produced prototypes reported breakdown voltage greater than 100 V. The chosen wafer of MCz 20 Ohm.cm P-type substrate resistivity can deplete a few tenths of um, where the process-driven surface damage can have a greater impact on device operating conditions before and after…
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